Electrical method on evaluation of power device chip's welding quality

Power devices are widely used in household appliances and industrial products even in the space industry. Because of defects in the package, their electrical parameters might change. Some of them may even lead to irreparable damage on devices. This paper presents a new method for evaluation of the d...

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Bibliographische Detailangaben
Hauptverfasser:	Shuojie She, Guangbo Gao, Yueqiang Huang, Gandhi, Darshan, Choudhry, Mahmood, Changzhi Lv
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Electrical resistance measurement Insulated gate bipolar transistors Semiconductor device measurement solder layer structure function Temperature measurement Thermal resistance Welding
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Beschreibung
Zusammenfassung:	Power devices are widely used in household appliances and industrial products even in the space industry. Because of defects in the package, their electrical parameters might change. Some of them may even lead to irreparable damage on devices. This paper presents a new method for evaluation of the device chips' welding quality, by means of analyzing thermal resistance and structure function of the power devices.
DOI:	10.1109/ICRMS.2011.5979242