Wafer-scale packaging for FBAR-based oscillators
Recent advances in temperature-compensation for FBAR (Film Bulk Acoustic Resonators) have brought this technology forward as a serious contender in the oscillator marketplace. As with any mechanical resonator oscillator, a cost-effective hermetic package combined with circuit technology are critical...
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Format: | Tagungsbericht |
Sprache: | eng |
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Zusammenfassung: | Recent advances in temperature-compensation for FBAR (Film Bulk Acoustic Resonators) have brought this technology forward as a serious contender in the oscillator marketplace. As with any mechanical resonator oscillator, a cost-effective hermetic package combined with circuit technology are critical for commercial application. Billions of FBAR duplexers have been fabricated using Avago Technologies' wafer-scale packaging process, whereby a silicon lid wafer is Au-diffusion-bonded to a base FBAR wafer to make a robust, hermetic package. This paper presents a method for integrating circuitry into the lid wafer to form a sub-0.1 mm 3 , sub mW, 1.5 GHz temperature-compensated chip-scale oscillator. Circuit integration, testing and performance will be discussed. |
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ISSN: | 2327-1914 |
DOI: | 10.1109/FCS.2011.5977848 |