Process transfers provide opportunities for more reliable products

In this paper the challenges and opportunities of a wafer fab process transfer are explained. Details and background of methodologies and choices made in the transfer of the back-end-of-line of a state-of-the-art SOI automotive process are explained. Field reliability results validate the choices ma...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kuper, F., Wessels, P., Ooms, E., van Herk, J., Rijnsburger, M., van Driel, W., Plagge, J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Automotive engineering Integrated circuits Metals Production facilities Robustness Semiconductor device reliability
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