Process transfers provide opportunities for more reliable products

Process transfers provide opportunities for more reliable products

In this paper the challenges and opportunities of a wafer fab process transfer are explained. Details and background of methodologies and choices made in the transfer of the back-end-of-line of a state-of-the-art SOI automotive process are explained. Field reliability results validate the choices ma...

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Bibliographische Detailangaben
Hauptverfasser: Kuper, F., Wessels, P., Ooms, E., van Herk, J., Rijnsburger, M., van Driel, W., Plagge, J.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Automotive engineering
Integrated circuits
Metals
Production facilities
Robustness
Semiconductor device reliability
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Beschreibung
Zusammenfassung:In this paper the challenges and opportunities of a wafer fab process transfer are explained. Details and background of methodologies and choices made in the transfer of the back-end-of-line of a state-of-the-art SOI automotive process are explained. Field reliability results validate the choices made.
ISSN:2380-632X
2380-6338
DOI:10.1109/IITC.2011.5940265