Integration of Solar Cells on Top of CMOS Chips-Part II: CIGS Solar Cells

We present the monolithic integration of deep-submicrometer complementary metal-oxide-semiconductor (CMOS) microchips with copper indium gallium (di)selenide (CIGS) solar cells. Solar cells are manufactured directly on unpackaged CMOS chips. The microchips maintain comparable electronic performance,...

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Veröffentlicht in:IEEE transactions on electron devices 2011-08, Vol.58 (8), p.2620-2627
Hauptverfasser: Jiwu Lu, Wei Liu, Kovalgin, Alexey Y., Yun Sun, Schmitz, Jurriaan
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container_issue 8
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container_title IEEE transactions on electron devices
container_volume 58
creator Jiwu Lu
Wei Liu
Kovalgin, Alexey Y.
Yun Sun
Schmitz, Jurriaan
description We present the monolithic integration of deep-submicrometer complementary metal-oxide-semiconductor (CMOS) microchips with copper indium gallium (di)selenide (CIGS) solar cells. Solar cells are manufactured directly on unpackaged CMOS chips. The microchips maintain comparable electronic performance, and the solar cells on top show an efficiency of 8.4 ± 0.8% and a yield of 84%, both values being close to the glass reference. The main integration issues, i.e., adhesion, surface topography, metal ion contamination, process temperature, and mechanical stress, can be resolved while maintaining standard photovoltaic processing. A tight process window is found for the manufacturing of CIGS solar cells on the CMOS side of the microchip. More process margin exists for backside integration.
doi_str_mv 10.1109/TED.2011.2156799
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fullrecord <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_ieee_primary_5937048</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5937048</ieee_id><sourcerecordid>2407285851</sourcerecordid><originalsourceid>FETCH-LOGICAL-c468t-8ce100989273e42fc872226780619456385440d849a16e7a3a85d2b37e4694923</originalsourceid><addsrcrecordid>eNp9kU1Lw0AQhhdRsFbvgpcgiF5Sd_Z7vUmsNVCp0Hpe1nSjKWkSd9OD_97EliIePA0z88zLzLwInQMeAWB9uxg_jAgGGBHgQmp9gAbAuYy1YOIQDTAGFWuq6DE6CWHVpYIxMkBpWrXu3du2qKuozqN5XVofJa4sQ9RVFnXTV5Pn2TxKPoomxC_Wt1Ga3kVJOpn_xk_RUW7L4M52cYheH8eL5CmeziZpcj-NMyZUG6vMAcZaaSKpYyTPlCSECKmwAM24oIozhpeKaQvCSUut4kvyRqVjQjNN6BBdb3UbX39uXGjNughZt4GtXL0JRoPWICWojrz5lwQhoXsCwT16-Qdd1RtfdXcYJTWmlP1AeAtlvg7Bu9w0vlhb_2UAm94E05lgehPMzoRu5Gqna0Nmy9zbKivCfo4wBlyRXvpiyxXOuX2bayoxU_QbM9OJYA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>879033408</pqid></control><display><type>article</type><title>Integration of Solar Cells on Top of CMOS Chips-Part II: CIGS Solar Cells</title><source>IEEE Electronic Library (IEL)</source><creator>Jiwu Lu ; Wei Liu ; Kovalgin, Alexey Y. ; Yun Sun ; Schmitz, Jurriaan</creator><creatorcontrib>Jiwu Lu ; Wei Liu ; Kovalgin, Alexey Y. ; Yun Sun ; Schmitz, Jurriaan</creatorcontrib><description>We present the monolithic integration of deep-submicrometer complementary metal-oxide-semiconductor (CMOS) microchips with copper indium gallium (di)selenide (CIGS) solar cells. Solar cells are manufactured directly on unpackaged CMOS chips. The microchips maintain comparable electronic performance, and the solar cells on top show an efficiency of 8.4 ± 0.8% and a yield of 84%, both values being close to the glass reference. The main integration issues, i.e., adhesion, surface topography, metal ion contamination, process temperature, and mechanical stress, can be resolved while maintaining standard photovoltaic processing. A tight process window is found for the manufacturing of CIGS solar cells on the CMOS side of the microchip. More process margin exists for backside integration.</description><identifier>ISSN: 0018-9383</identifier><identifier>EISSN: 1557-9646</identifier><identifier>DOI: 10.1109/TED.2011.2156799</identifier><identifier>CODEN: IETDAI</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>ADHESION ; Adhesives ; Applied sciences ; CHIPS ; CIGS ; CMOS ; CMOS integrated circuits ; Complementary metal-oxide-semiconductor (CMOS) ; copper indium gallium selenide (CIGS) ; Copper indium gallium selenides ; Design. Technologies. Operation analysis. Testing ; ELECTRONIC PRODUCTS ; Electronics ; Energy ; energy harvesting ; Exact sciences and technology ; Glass ; Indium ; Integrated circuits ; monolithic integration ; Natural energy ; Optoelectronic devices ; photovoltaic (PV) cells ; Photovoltaic cells ; Photovoltaic conversion ; scavenging ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; SEMICONDUCTORS ; smart dust ; Solar cells ; Solar cells. Photoelectrochemical cells ; Solar energy ; Substrates ; Surface topography ; Topography</subject><ispartof>IEEE transactions on electron devices, 2011-08, Vol.58 (8), p.2620-2627</ispartof><rights>2015 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Aug 2011</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c468t-8ce100989273e42fc872226780619456385440d849a16e7a3a85d2b37e4694923</citedby><cites>FETCH-LOGICAL-c468t-8ce100989273e42fc872226780619456385440d849a16e7a3a85d2b37e4694923</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5937048$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5937048$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&amp;idt=24415828$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Jiwu Lu</creatorcontrib><creatorcontrib>Wei Liu</creatorcontrib><creatorcontrib>Kovalgin, Alexey Y.</creatorcontrib><creatorcontrib>Yun Sun</creatorcontrib><creatorcontrib>Schmitz, Jurriaan</creatorcontrib><title>Integration of Solar Cells on Top of CMOS Chips-Part II: CIGS Solar Cells</title><title>IEEE transactions on electron devices</title><addtitle>TED</addtitle><description>We present the monolithic integration of deep-submicrometer complementary metal-oxide-semiconductor (CMOS) microchips with copper indium gallium (di)selenide (CIGS) solar cells. Solar cells are manufactured directly on unpackaged CMOS chips. The microchips maintain comparable electronic performance, and the solar cells on top show an efficiency of 8.4 ± 0.8% and a yield of 84%, both values being close to the glass reference. The main integration issues, i.e., adhesion, surface topography, metal ion contamination, process temperature, and mechanical stress, can be resolved while maintaining standard photovoltaic processing. A tight process window is found for the manufacturing of CIGS solar cells on the CMOS side of the microchip. More process margin exists for backside integration.</description><subject>ADHESION</subject><subject>Adhesives</subject><subject>Applied sciences</subject><subject>CHIPS</subject><subject>CIGS</subject><subject>CMOS</subject><subject>CMOS integrated circuits</subject><subject>Complementary metal-oxide-semiconductor (CMOS)</subject><subject>copper indium gallium selenide (CIGS)</subject><subject>Copper indium gallium selenides</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>ELECTRONIC PRODUCTS</subject><subject>Electronics</subject><subject>Energy</subject><subject>energy harvesting</subject><subject>Exact sciences and technology</subject><subject>Glass</subject><subject>Indium</subject><subject>Integrated circuits</subject><subject>monolithic integration</subject><subject>Natural energy</subject><subject>Optoelectronic devices</subject><subject>photovoltaic (PV) cells</subject><subject>Photovoltaic cells</subject><subject>Photovoltaic conversion</subject><subject>scavenging</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>SEMICONDUCTORS</subject><subject>smart dust</subject><subject>Solar cells</subject><subject>Solar cells. Photoelectrochemical cells</subject><subject>Solar energy</subject><subject>Substrates</subject><subject>Surface topography</subject><subject>Topography</subject><issn>0018-9383</issn><issn>1557-9646</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp9kU1Lw0AQhhdRsFbvgpcgiF5Sd_Z7vUmsNVCp0Hpe1nSjKWkSd9OD_97EliIePA0z88zLzLwInQMeAWB9uxg_jAgGGBHgQmp9gAbAuYy1YOIQDTAGFWuq6DE6CWHVpYIxMkBpWrXu3du2qKuozqN5XVofJa4sQ9RVFnXTV5Pn2TxKPoomxC_Wt1Ga3kVJOpn_xk_RUW7L4M52cYheH8eL5CmeziZpcj-NMyZUG6vMAcZaaSKpYyTPlCSECKmwAM24oIozhpeKaQvCSUut4kvyRqVjQjNN6BBdb3UbX39uXGjNughZt4GtXL0JRoPWICWojrz5lwQhoXsCwT16-Qdd1RtfdXcYJTWmlP1AeAtlvg7Bu9w0vlhb_2UAm94E05lgehPMzoRu5Gqna0Nmy9zbKivCfo4wBlyRXvpiyxXOuX2bayoxU_QbM9OJYA</recordid><startdate>20110801</startdate><enddate>20110801</enddate><creator>Jiwu Lu</creator><creator>Wei Liu</creator><creator>Kovalgin, Alexey Y.</creator><creator>Yun Sun</creator><creator>Schmitz, Jurriaan</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>7QQ</scope><scope>F28</scope><scope>FR3</scope><scope>H8G</scope><scope>JG9</scope></search><sort><creationdate>20110801</creationdate><title>Integration of Solar Cells on Top of CMOS Chips-Part II: CIGS Solar Cells</title><author>Jiwu Lu ; Wei Liu ; Kovalgin, Alexey Y. ; Yun Sun ; Schmitz, Jurriaan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c468t-8ce100989273e42fc872226780619456385440d849a16e7a3a85d2b37e4694923</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>ADHESION</topic><topic>Adhesives</topic><topic>Applied sciences</topic><topic>CHIPS</topic><topic>CIGS</topic><topic>CMOS</topic><topic>CMOS integrated circuits</topic><topic>Complementary metal-oxide-semiconductor (CMOS)</topic><topic>copper indium gallium selenide (CIGS)</topic><topic>Copper indium gallium selenides</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>ELECTRONIC PRODUCTS</topic><topic>Electronics</topic><topic>Energy</topic><topic>energy harvesting</topic><topic>Exact sciences and technology</topic><topic>Glass</topic><topic>Indium</topic><topic>Integrated circuits</topic><topic>monolithic integration</topic><topic>Natural energy</topic><topic>Optoelectronic devices</topic><topic>photovoltaic (PV) cells</topic><topic>Photovoltaic cells</topic><topic>Photovoltaic conversion</topic><topic>scavenging</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>SEMICONDUCTORS</topic><topic>smart dust</topic><topic>Solar cells</topic><topic>Solar cells. Photoelectrochemical cells</topic><topic>Solar energy</topic><topic>Substrates</topic><topic>Surface topography</topic><topic>Topography</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Jiwu Lu</creatorcontrib><creatorcontrib>Wei Liu</creatorcontrib><creatorcontrib>Kovalgin, Alexey Y.</creatorcontrib><creatorcontrib>Yun Sun</creatorcontrib><creatorcontrib>Schmitz, Jurriaan</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Ceramic Abstracts</collection><collection>ANTE: Abstracts in New Technology &amp; Engineering</collection><collection>Engineering Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><jtitle>IEEE transactions on electron devices</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jiwu Lu</au><au>Wei Liu</au><au>Kovalgin, Alexey Y.</au><au>Yun Sun</au><au>Schmitz, Jurriaan</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Integration of Solar Cells on Top of CMOS Chips-Part II: CIGS Solar Cells</atitle><jtitle>IEEE transactions on electron devices</jtitle><stitle>TED</stitle><date>2011-08-01</date><risdate>2011</risdate><volume>58</volume><issue>8</issue><spage>2620</spage><epage>2627</epage><pages>2620-2627</pages><issn>0018-9383</issn><eissn>1557-9646</eissn><coden>IETDAI</coden><abstract>We present the monolithic integration of deep-submicrometer complementary metal-oxide-semiconductor (CMOS) microchips with copper indium gallium (di)selenide (CIGS) solar cells. Solar cells are manufactured directly on unpackaged CMOS chips. The microchips maintain comparable electronic performance, and the solar cells on top show an efficiency of 8.4 ± 0.8% and a yield of 84%, both values being close to the glass reference. The main integration issues, i.e., adhesion, surface topography, metal ion contamination, process temperature, and mechanical stress, can be resolved while maintaining standard photovoltaic processing. A tight process window is found for the manufacturing of CIGS solar cells on the CMOS side of the microchip. More process margin exists for backside integration.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TED.2011.2156799</doi><tpages>8</tpages><oa>free_for_read</oa></addata></record>
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subjects ADHESION
Adhesives
Applied sciences
CHIPS
CIGS
CMOS
CMOS integrated circuits
Complementary metal-oxide-semiconductor (CMOS)
copper indium gallium selenide (CIGS)
Copper indium gallium selenides
Design. Technologies. Operation analysis. Testing
ELECTRONIC PRODUCTS
Electronics
Energy
energy harvesting
Exact sciences and technology
Glass
Indium
Integrated circuits
monolithic integration
Natural energy
Optoelectronic devices
photovoltaic (PV) cells
Photovoltaic cells
Photovoltaic conversion
scavenging
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
SEMICONDUCTORS
smart dust
Solar cells
Solar cells. Photoelectrochemical cells
Solar energy
Substrates
Surface topography
Topography
title Integration of Solar Cells on Top of CMOS Chips-Part II: CIGS Solar Cells
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T13%3A57%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Integration%20of%20Solar%20Cells%20on%20Top%20of%20CMOS%20Chips-Part%20II:%20CIGS%20Solar%20Cells&rft.jtitle=IEEE%20transactions%20on%20electron%20devices&rft.au=Jiwu%20Lu&rft.date=2011-08-01&rft.volume=58&rft.issue=8&rft.spage=2620&rft.epage=2627&rft.pages=2620-2627&rft.issn=0018-9383&rft.eissn=1557-9646&rft.coden=IETDAI&rft_id=info:doi/10.1109/TED.2011.2156799&rft_dat=%3Cproquest_RIE%3E2407285851%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=879033408&rft_id=info:pmid/&rft_ieee_id=5937048&rfr_iscdi=true