Test structures for characterising a damascene CMP interconnect process
This paper presents some test structures that can be used to help characterize interconnect fabricated using a CMP damascene process. Electrical measurements of the test structures are compared with those obtained using an AFM and surface profiling.
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| creator | Peyne, C.M. O'Hara, A. Stevenson, J.T.M. Elliott, J.P. Walton, A.J. Fallon, M. |
| description | This paper presents some test structures that can be used to help characterize interconnect fabricated using a CMP damascene process. Electrical measurements of the test structures are compared with those obtained using an AFM and surface profiling. |
| doi_str_mv | 10.1109/ICMTS.1997.589369 |
| format | Conference Proceeding |
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Electrical measurements of the test structures are compared with those obtained using an AFM and surface profiling.</abstract><pub>IEEE</pub><doi>10.1109/ICMTS.1997.589369</doi><tpages>5</tpages></addata></record> |
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| identifier | ISBN: 0780332431 |
| ispartof | 1997 IEEE International Conference on Microelectronic Test Structures Proceedings, 1997, p.151-155 |
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| language | eng |
| recordid | cdi_ieee_primary_589369 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Aluminum Atomic measurements Conducting materials Copper Dielectric materials Dielectric measurements Etching Surface topography Testing Textile industry |
| title | Test structures for characterising a damascene CMP interconnect process |
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