Test structures for characterising a damascene CMP interconnect process

Test structures for characterising a damascene CMP interconnect process

This paper presents some test structures that can be used to help characterize interconnect fabricated using a CMP damascene process. Electrical measurements of the test structures are compared with those obtained using an AFM and surface profiling.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Peyne, C.M., O'Hara, A., Stevenson, J.T.M., Elliott, J.P., Walton, A.J., Fallon, M.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Aluminum
Atomic measurements
Conducting materials
Copper
Dielectric materials
Dielectric measurements
Etching
Surface topography
Testing
Textile industry
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:This paper presents some test structures that can be used to help characterize interconnect fabricated using a CMP damascene process. Electrical measurements of the test structures are compared with those obtained using an AFM and surface profiling.
DOI:10.1109/ICMTS.1997.589369