Electrical assessment of planarisation for CMP [inter-layer dielectrics]

Electrical assessment of planarisation for CMP [inter-layer dielectrics]

Experimental measurements of an electrical test structure for use in assessment of the degree of planarisation of inter-layer dielectrics are presented and compared with theoretical predictions. The test structure consists of two sets of metal combs separated by a dielectric. For each structure the...

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Bibliographische Detailangaben
Hauptverfasser: Elliott, J.P., Fallon, M., Walton, A.J., Stevenson, J.T.M., O'Hara, A., Shaffi, A., Reeves, C.M.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Buildings
Capacitance
Dielectric measurements
Electric variables measurement
Integrated circuit interconnections
Planarization
Robustness
Surfaces
Teeth
Testing
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Beschreibung
Zusammenfassung:Experimental measurements of an electrical test structure for use in assessment of the degree of planarisation of inter-layer dielectrics are presented and compared with theoretical predictions. The test structure consists of two sets of metal combs separated by a dielectric. For each structure the combs on the two layers overlap each other by some degree, with adjacent structures having the overlap in one direction progressionally offset by 0.2 /spl mu/m. It is demonstrated theoretically that the structure is robust to expected levels of oxide thickness variation.
DOI:10.1109/ICMTS.1997.589345