Buried Ceramic Layer Formation In Glass And Silicon Using Plasma Source Ion Implantation

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Hauptverfasser: Booske, J.H., Zhan, L., Cooper, R.F., Shohet, J.L., Shenai, K., Dallman, D., Goeckner, M.J., Breun, R., Hitchon, W.N.G., Wickesberg, E., Speth, R., Jacobs, J.R., Was, G.
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creator Booske, J.H.
Zhan, L.
Cooper, R.F.
Shohet, J.L.
Shenai, K.
Dallman, D.
Goeckner, M.J.
Breun, R.
Hitchon, W.N.G.
Wickesberg, E.
Speth, R.
Jacobs, J.R.
Was, G.
description
doi_str_mv 10.1109/PLASMA.1994.588985
format Conference Proceeding
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identifier ISSN: 0730-9244
ispartof Proceedings of 1994 IEEE 21st International Conference on Plasma Sciences (ICOPS), 1994, p.166-166
issn 0730-9244
2576-7208
language eng
recordid cdi_ieee_primary_588985
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Ceramics
CMOS technology
DNA
Electron beams
Flue gases
Glass
Ion implantation
Plasma sources
Silicon
Surface treatment
title Buried Ceramic Layer Formation In Glass And Silicon Using Plasma Source Ion Implantation
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