Optical I/O for chip-to-chip interconnects on CMOS platform

Optical devices on a CMOS die and package for terabit computing are discussed. 200Gbps transmission is accomplished with a 1×10 VCSEL array. CMOS backend compatible modulators and photodetectors are demonstrated at 40Gbps for on-die integration.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Chang, P L D, Mohammed, E M, Block, B A, Reshotko, M R, Young, I A
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	(130.6622) Subsystem integration and techniques (200.4650) Optical interconnects (230.4110) Modulators (230.5160) Photodetectors (250.2080) Polymer active devices (250.5300) Photonic integrated circuits CMOS integrated circuits High speed optical techniques Modulation Optical coupling Optical fibers
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Optical devices on a CMOS die and package for terabit computing are discussed. 200Gbps transmission is accomplished with a 1×10 VCSEL array. CMOS backend compatible modulators and photodetectors are demonstrated at 40Gbps for on-die integration.
DOI:	10.1364/ofc.2011.othq1