Packaging of optoelectronics and passive optics for intrasystem interconnects

Summary form only given. Optical backplanes can enhance the functionality of large system products at reasonable cost. In order to further exploit high technology, high fibre count multivendor multifiber array backplane connectors are needed. Intermateability at the backplane is a key goal. This should not preclude a wide variety of packaging approaches on both sides of the backplane. Standard multimode and single mode fibers should be supported, along with specialty fibers if desired. Two dimensional arrays with high fiber counts will be particularly useful. Backplane interconnection density is crucial and multifiber array connectors are powerful tools in this area.