Scanned area and batch size effects on productivity for 150, 200 and 300 mm wafers

The relationships between wafer size, wheel batch size, wheel radius, wafer packing fraction and ion beam width are explored for batch implanters designs for 150, 200 and 300 mm wafers. Analytical expressions for geometrical factors such as the scanned area fraction, the ratio of the area of Si wafers implanted to the scanned area, are derived for several batch and serial implanter geometry. The impact on the matching of process and transfer lot batch sizes on the dummy loading factors is also analysed.