Al/SiC for power electronics packaging

Al/SiC for power electronics packaging

Al/SiC composites have a CTE that very closely matches ceramics along with a high thermal conductivity. In addition, these composites also have an elastic modulus that is 2/spl times/ that of Cu and a density that is 66% less than that of Cu. These properties allow for a package design that is signi...

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Bibliographische Detailangaben
1. Verfasser: Premkumar, M.K.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Ceramics
Composite materials
Conducting materials
Electronic packaging thermal management
Electronics packaging
Mechanical factors
Preforms
Silicon carbide
Thermal conductivity
Thermal resistance
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Zusammenfassung:Al/SiC composites have a CTE that very closely matches ceramics along with a high thermal conductivity. In addition, these composites also have an elastic modulus that is 2/spl times/ that of Cu and a density that is 66% less than that of Cu. These properties allow for a package design that is significantly superior to the traditional Cu baseplate design. This presentation discusses the unique properties of Al/SiC as it applies to power electronics packaging. The results of thermal cycling and other reliability testing of Al/SiC products are presented and discussed.
DOI:10.1109/ISAPM.1997.581284