Design of on-chip Transient Voltage Suppressor in a silicon-based transceiver IC to meet IEC system-level ESD specification
The on-chip Transient Voltage Suppressor (TVS) embedded in the silicon based transceiver IC has been proposed in this paper by using 0.8 μm Bipolar-CMOS-DMOS (BCD) process. The structure of the on-chip TVS is a high voltage Dual Silicon-Controlled-Rectifier (DSCR) with ±19V of high holding voltage (...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Tagungsbericht |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The on-chip Transient Voltage Suppressor (TVS) embedded in the silicon based transceiver IC has been proposed in this paper by using 0.8 μm Bipolar-CMOS-DMOS (BCD) process. The structure of the on-chip TVS is a high voltage Dual Silicon-Controlled-Rectifier (DSCR) with ±19V of high holding voltage (Vh) under the evaluation of 100 ns pulse width of the Transmission Line Pulsing (TLP) system. The holding current (Ih) of the on-chip TVS is so high that can pass ±200 mA latchup testing. Therefore, the on-chip TVS can be safely applied to protect the ±12 V of signal level for RS232. The RS232 transceiver IC with on-chip TVS has been evaluated to pass the IEC61000-4-2 contact ±12 kV stress without any hard damages and latchup issue. Moreover, the RS232 transceiver IC also has been verified to well protect the system over the IEC61000-4-2 contact ±20 kV stress (CLASS B) in the smart scanner and notebook application. |
---|---|
ISSN: | 2381-3555 2691-0462 |
DOI: | 10.1109/ICICDT.2011.5783236 |