High temperature automotive application: A study on fine pitch Au and Cu WB integrity vs. Ni thickness of Ni/Pd/Au bond pad on C90 low k wafer technology

High temperature automotive application: A study on fine pitch Au and Cu WB integrity vs. Ni thickness of Ni/Pd/Au bond pad on C90 low k wafer technology

For high temperature automotive application, IC products are required to pass stringent high temperature storage stress test (e.g. 5000hrs at 150 deg C), hence requires reliable wire bonds. Such requirement is especially challenging with fine pitch Au & Cu wire bond (e.g. bond pad pitch

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Bibliographische Detailangaben
Hauptverfasser: Eu Poh Leng, Poh Zi Song, Au Yin Kheng, Yong, C C, Tran Tu Anh, Arthur, J, Downey, H, Mathew, V, Chee Yit Yin
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Aging
Bonding
Copper
Gold
Intermetallic
Nickel
Wire
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Zusammenfassung:For high temperature automotive application, IC products are required to pass stringent high temperature storage stress test (e.g. 5000hrs at 150 deg C), hence requires reliable wire bonds. Such requirement is especially challenging with fine pitch Au & Cu wire bond (e.g. bond pad pitch
DOI:10.1109/EPTC.2010.5702661