Hybrid-integrated silicon photonic circuit with an InGaAs photodetetor

Flip-chip bonding and grating-assisted coupling techniques are proposed to integrate silicon photonic circuit with an InGaAs photodetector. Coupler-to-photodetector coupling efficiency of ~4 dB and data transmission of 1 Gbps are demonstrated.

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Bibliographische Detailangaben
Hauptverfasser: Haihua Xu, Yingtao Hu, Yu Zhu, Yuntao Li, Zhiyong Li, Zhongchao Fan, Yude Yu, Jinzhong Yu
Format: Tagungsbericht
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Flip-chip bonding and grating-assisted coupling techniques are proposed to integrate silicon photonic circuit with an InGaAs photodetector. Coupler-to-photodetector coupling efficiency of ~4 dB and data transmission of 1 Gbps are demonstrated.
ISSN:1949-2081
1949-209X
DOI:10.1109/GROUP4.2010.5643404