Hybrid-integrated silicon photonic circuit with an InGaAs photodetetor
Flip-chip bonding and grating-assisted coupling techniques are proposed to integrate silicon photonic circuit with an InGaAs photodetector. Coupler-to-photodetector coupling efficiency of ~4 dB and data transmission of 1 Gbps are demonstrated.
Gespeichert in:
Hauptverfasser: | , , , , , , , |
---|---|
Format: | Tagungsbericht |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Flip-chip bonding and grating-assisted coupling techniques are proposed to integrate silicon photonic circuit with an InGaAs photodetector. Coupler-to-photodetector coupling efficiency of ~4 dB and data transmission of 1 Gbps are demonstrated. |
---|---|
ISSN: | 1949-2081 1949-209X |
DOI: | 10.1109/GROUP4.2010.5643404 |