Electrical characterization of annular through silicon vias for a reconfigurable wafer-sized circuit board

This paper presents the electrical characterization of annular TSV technology for full wafer applications. A possible utilization of this technology is the WaferBoard™, a reconfigurable circuit board for rapid system prototyping. Electrical resistance and capacitance of a single 2-4μm thick annular...

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Hauptverfasser:	Diop, M D, Radji, M, Andre, W, Blaquière, Yves, Hamoui, A A, Izquierdo, R
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	annular TSV component Copper electrical resistance and capacitance Electrical resistance measurement Integrated circuit interconnections Resistance Routing Silicon Through-silicon vias WaferBoard
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creator	Diop, M D Radji, M Andre, W Blaquière, Yves Hamoui, A A Izquierdo, R
description	This paper presents the electrical characterization of annular TSV technology for full wafer applications. A possible utilization of this technology is the WaferBoard™, a reconfigurable circuit board for rapid system prototyping. Electrical resistance and capacitance of a single 2-4μm thick annular TSV with a diameter of 110μm and a height of 350μm are measured to be about 10mΩ and 0.27pF, respectively. TSV yield of 98% is reached over the wafer. Results also show electrical failure of some TSVs due to poor via filling.
doi_str_mv	10.1109/EPEPS.2010.5642596
format	Conference Proceeding
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A possible utilization of this technology is the WaferBoard™, a reconfigurable circuit board for rapid system prototyping. Electrical resistance and capacitance of a single 2-4μm thick annular TSV with a diameter of 110μm and a height of 350μm are measured to be about 10mΩ and 0.27pF, respectively. TSV yield of 98% is reached over the wafer. Results also show electrical failure of some TSVs due to poor via filling.</abstract><pub>IEEE</pub><doi>10.1109/EPEPS.2010.5642596</doi><tpages>4</tpages></addata></record>
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subjects	annular TSV component Copper electrical resistance and capacitance Electrical resistance measurement Integrated circuit interconnections Resistance Routing Silicon Through-silicon vias WaferBoard
title	Electrical characterization of annular through silicon vias for a reconfigurable wafer-sized circuit board
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