Reduction of the coupling between microstrip arrays antennas using High Impedance Surface (HIS) structures

Electromagnetic Band-gap (EBG) or High Impedance Surface (HIS) structures are becoming more and more utilized in the microstrip antennas and particularly to reduce the mutual coupling between the radiate elements or arrays antennas. In this paper, firstly, the band-gap feature of HIS Mushroom-like a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Cuong Tran Manh, Xiaoke Han, Ouslimani, H Hafdallah, Priou, Alain, Marteau, Aurélien, Collignon, Gérard
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Electromagnetic Band-gap (EBG) or High Impedance Surface (HIS) structures are becoming more and more utilized in the microstrip antennas and particularly to reduce the mutual coupling between the radiate elements or arrays antennas. In this paper, firstly, the band-gap feature of HIS Mushroom-like and Fork-like have been studied by CST Microwave Studio (MWS) for application at 10 GHz and radio altimeter at 4.3 GHz. Secondly, those HIS structures are integrated into an antenna arrays system to reduce the mutual coupling for both frequency domain. The investigation includes both E and H coupling directions. A drastically mutual coupling reduction is reached ~31 dB at 10 GHz and ~25 dB at 4.3 GHz.
DOI:10.23919/EUMC.2010.5616352