A novel Intelligent Power Module (IPM) in a compact transfer Mold package with New High Voltage Integrated Circuit (HVIC) and integrated bootstrap diodes

Transfer Mold IPM employs a novel insulated thermal sheet technology and Full-Gate CSTBT™ ranging from 5A to 15A with blocking voltage of 600V. The complete protection functions and the novel HVIC and bootstrap diode being integrated into the package structure create a state-of-the-art IPM which can...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ozkilic, M C, Honsberg, M, Radke, T
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Capacitors Delay High Voltage IC's efficiency IGBT Insulated gate bipolar transistors JPM (Intelligent Power Module) Logic gates Resistance Temperature sensors Thermal conductivity
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