A novel Intelligent Power Module (IPM) in a compact transfer Mold package with New High Voltage Integrated Circuit (HVIC) and integrated bootstrap diodes

A novel Intelligent Power Module (IPM) in a compact transfer Mold package with New High Voltage Integrated Circuit (HVIC) and integrated bootstrap diodes

Transfer Mold IPM employs a novel insulated thermal sheet technology and Full-Gate CSTBT™ ranging from 5A to 15A with blocking voltage of 600V. The complete protection functions and the novel HVIC and bootstrap diode being integrated into the package structure create a state-of-the-art IPM which can...

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Bibliographische Detailangaben
Hauptverfasser: Ozkilic, M C, Honsberg, M, Radke, T
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Capacitors
Delay
High Voltage IC's efficiency
IGBT
Insulated gate bipolar transistors
JPM (Intelligent Power Module)
Logic gates
Resistance
Temperature sensors
Thermal conductivity
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Beschreibung
Zusammenfassung:Transfer Mold IPM employs a novel insulated thermal sheet technology and Full-Gate CSTBT™ ranging from 5A to 15A with blocking voltage of 600V. The complete protection functions and the novel HVIC and bootstrap diode being integrated into the package structure create a state-of-the-art IPM which can be evaluated easily by the described evaluation platform.
DOI:10.1109/EPEPEMC.2010.5606819