A study of the bonding-wire reliability on the chip surface electrode in IGBT

The reliability of IGBT chip surface electrode for bonding-wires is described. The power cycling (P/C) capability of an IGBT module is improved due to a suppression of chip surface aluminum (Al) electrode degradation with Nickel (Ni) plating. The P/C capability obtained with the Ni plating electrode...

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Bibliographische Detailangaben

Hauptverfasser:	Ikeda, Y, Hokazono, H, Sakaf, S, Nishimura, T, Takahashi, Y
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding Copper Electrodes Insulated gate bipolar transistors Motor drives Power semiconductor devices Solar energy Temperature Testing Traction power supplies
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