RF MEMS wafer-level packaging using solder paste by via filling process

RF MEMS wafer-level packaging using solder paste by via filling process

In this paper, the design, fabrication technology, and experimental evaluation of the RF frequency performance of a new type of solder paste via filled through-wafer interconnects in silicon substrates are presented.

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Bibliographische Detailangaben
Hauptverfasser: Sunghae Jung, Myunglae Lee, Jong-Tae Moon
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Chemical lasers
Copper
Etching
Filling
Radio frequency
Radiofrequency microelectromechanical systems
rf mems
Silicon
solder
switch
Switches
via
Wafer bonding
Wafer scale integration
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Beschreibung
Zusammenfassung:In this paper, the design, fabrication technology, and experimental evaluation of the RF frequency performance of a new type of solder paste via filled through-wafer interconnects in silicon substrates are presented.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2010.5490672