Vertical metal interconnect thanks to tungsten direct bonding

Localized metal bonding is one of the main drivers for 3D technology implementation as it allows high vertical interconnection densities between piled up dies. In this paper we will present the direct bonding of tungsten blanket. The copper and tungsten direct bonding will be compared in terms of bo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Di Cioccio, Léa, Gueguen, Pierric, Grouiller, Etienne, Vandroux, Laurent, Delaye, Vincent, Rivoire, Maurice, Lugand, Jean François, Clavelier, Laurent
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Atomic force microscopy Bonding forces Copper Pollution measurement Rough surfaces Surface roughness Temperature dependence Tin Tungsten Wafer bonding
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!