Reliability of Ferroelectric Random Access memory embedded within 130nm CMOS

We present results of a comprehensive reliability evaluation of a 2T-2C, 4Mb, Ferroelectric Random Access Memory embedded within a standard 130nm, 5LM Cu CMOS platform. Wear-out free endurance to 5.4 × 10 13 cycles and data retention equivalent of 10 years at 85°C is demonstrated. The results show t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Rodriguez, J, Remack, K, Gertas, J, Wang, L, Zhou, C, Boku, K, Rodriguez-Latorre, J, Udayakumar, K R, Summerfelt, S, Moise, T, Kim, D, Groat, J, Eliason, J, Depner, M, Chu, F
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 758
container_issue
container_start_page 750
container_title
container_volume
creator Rodriguez, J
Remack, K
Gertas, J
Wang, L
Zhou, C
Boku, K
Rodriguez-Latorre, J
Udayakumar, K R
Summerfelt, S
Moise, T
Kim, D
Groat, J
Eliason, J
Depner, M
Chu, F
description We present results of a comprehensive reliability evaluation of a 2T-2C, 4Mb, Ferroelectric Random Access Memory embedded within a standard 130nm, 5LM Cu CMOS platform. Wear-out free endurance to 5.4 × 10 13 cycles and data retention equivalent of 10 years at 85°C is demonstrated. The results show that the technology can be used in a wide range of applications including embedded processing.
doi_str_mv 10.1109/IRPS.2010.5488738
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_5488738</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5488738</ieee_id><sourcerecordid>5488738</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-7d0da5975756c2a72dd84bdedf978d6e2e2a22a59392268004ced56af30fa8283</originalsourceid><addsrcrecordid>eNo9UNtKw0AUXC8Fa-0HiC_7A6m7Z--PJVgtRCqpPpdN9gRXcpEkIPl7AxbnZRhmGIYh5J6zDefMPe7zt-MG2CyVtNYIe0FuuQQplQRnL8mSO2ETbh2_-jcE49ezoSRPDAO9IEsLiZZMcHFD1sPwxWZIBVrKJclyrKMvYh3HiXYV3WHfd1hjOfaxpLlvQ9fQbVniMNAGm66fKDYFhoCB_sTxM7aUC9Y2NH09HO_IovL1gOszr8jH7uk9fUmyw_M-3WZJ5EaNiQkseOWMMkqX4A2EYGUxN1bO2KAREDzAnBAOQNt5bIlBaV8JVnkLVqzIw19vRMTTdx8b30-n80PiF3kCUsQ</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Reliability of Ferroelectric Random Access memory embedded within 130nm CMOS</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Rodriguez, J ; Remack, K ; Gertas, J ; Wang, L ; Zhou, C ; Boku, K ; Rodriguez-Latorre, J ; Udayakumar, K R ; Summerfelt, S ; Moise, T ; Kim, D ; Groat, J ; Eliason, J ; Depner, M ; Chu, F</creator><creatorcontrib>Rodriguez, J ; Remack, K ; Gertas, J ; Wang, L ; Zhou, C ; Boku, K ; Rodriguez-Latorre, J ; Udayakumar, K R ; Summerfelt, S ; Moise, T ; Kim, D ; Groat, J ; Eliason, J ; Depner, M ; Chu, F</creatorcontrib><description>We present results of a comprehensive reliability evaluation of a 2T-2C, 4Mb, Ferroelectric Random Access Memory embedded within a standard 130nm, 5LM Cu CMOS platform. Wear-out free endurance to 5.4 × 10 13 cycles and data retention equivalent of 10 years at 85°C is demonstrated. The results show that the technology can be used in a wide range of applications including embedded processing.</description><identifier>ISSN: 1541-7026</identifier><identifier>ISBN: 1424454301</identifier><identifier>ISBN: 9781424454303</identifier><identifier>EISSN: 1938-1891</identifier><identifier>EISBN: 1424454298</identifier><identifier>EISBN: 9781424454297</identifier><identifier>EISBN: 9781424454310</identifier><identifier>EISBN: 142445431X</identifier><identifier>DOI: 10.1109/IRPS.2010.5488738</identifier><identifier>LCCN: 82-640313</identifier><language>eng</language><publisher>IEEE</publisher><subject>Capacitors ; Circuits ; Copper ; cycling endurance ; data retention ; embedded memory ; Ferroelectric films ; Ferroelectric materials ; ferroelectric memory reliability ; high-temperature operating life ; Intelligent sensors ; Low voltage ; Nonvolatile memory ; Polarization ; Random access memory ; sof-error rate</subject><ispartof>2010 IEEE International Reliability Physics Symposium, 2010, p.750-758</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5488738$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,778,782,787,788,2054,27912,54907</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5488738$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Rodriguez, J</creatorcontrib><creatorcontrib>Remack, K</creatorcontrib><creatorcontrib>Gertas, J</creatorcontrib><creatorcontrib>Wang, L</creatorcontrib><creatorcontrib>Zhou, C</creatorcontrib><creatorcontrib>Boku, K</creatorcontrib><creatorcontrib>Rodriguez-Latorre, J</creatorcontrib><creatorcontrib>Udayakumar, K R</creatorcontrib><creatorcontrib>Summerfelt, S</creatorcontrib><creatorcontrib>Moise, T</creatorcontrib><creatorcontrib>Kim, D</creatorcontrib><creatorcontrib>Groat, J</creatorcontrib><creatorcontrib>Eliason, J</creatorcontrib><creatorcontrib>Depner, M</creatorcontrib><creatorcontrib>Chu, F</creatorcontrib><title>Reliability of Ferroelectric Random Access memory embedded within 130nm CMOS</title><title>2010 IEEE International Reliability Physics Symposium</title><addtitle>IRPS</addtitle><description>We present results of a comprehensive reliability evaluation of a 2T-2C, 4Mb, Ferroelectric Random Access Memory embedded within a standard 130nm, 5LM Cu CMOS platform. Wear-out free endurance to 5.4 × 10 13 cycles and data retention equivalent of 10 years at 85°C is demonstrated. The results show that the technology can be used in a wide range of applications including embedded processing.</description><subject>Capacitors</subject><subject>Circuits</subject><subject>Copper</subject><subject>cycling endurance</subject><subject>data retention</subject><subject>embedded memory</subject><subject>Ferroelectric films</subject><subject>Ferroelectric materials</subject><subject>ferroelectric memory reliability</subject><subject>high-temperature operating life</subject><subject>Intelligent sensors</subject><subject>Low voltage</subject><subject>Nonvolatile memory</subject><subject>Polarization</subject><subject>Random access memory</subject><subject>sof-error rate</subject><issn>1541-7026</issn><issn>1938-1891</issn><isbn>1424454301</isbn><isbn>9781424454303</isbn><isbn>1424454298</isbn><isbn>9781424454297</isbn><isbn>9781424454310</isbn><isbn>142445431X</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2010</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo9UNtKw0AUXC8Fa-0HiC_7A6m7Z--PJVgtRCqpPpdN9gRXcpEkIPl7AxbnZRhmGIYh5J6zDefMPe7zt-MG2CyVtNYIe0FuuQQplQRnL8mSO2ETbh2_-jcE49ezoSRPDAO9IEsLiZZMcHFD1sPwxWZIBVrKJclyrKMvYh3HiXYV3WHfd1hjOfaxpLlvQ9fQbVniMNAGm66fKDYFhoCB_sTxM7aUC9Y2NH09HO_IovL1gOszr8jH7uk9fUmyw_M-3WZJ5EaNiQkseOWMMkqX4A2EYGUxN1bO2KAREDzAnBAOQNt5bIlBaV8JVnkLVqzIw19vRMTTdx8b30-n80PiF3kCUsQ</recordid><startdate>201005</startdate><enddate>201005</enddate><creator>Rodriguez, J</creator><creator>Remack, K</creator><creator>Gertas, J</creator><creator>Wang, L</creator><creator>Zhou, C</creator><creator>Boku, K</creator><creator>Rodriguez-Latorre, J</creator><creator>Udayakumar, K R</creator><creator>Summerfelt, S</creator><creator>Moise, T</creator><creator>Kim, D</creator><creator>Groat, J</creator><creator>Eliason, J</creator><creator>Depner, M</creator><creator>Chu, F</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>201005</creationdate><title>Reliability of Ferroelectric Random Access memory embedded within 130nm CMOS</title><author>Rodriguez, J ; Remack, K ; Gertas, J ; Wang, L ; Zhou, C ; Boku, K ; Rodriguez-Latorre, J ; Udayakumar, K R ; Summerfelt, S ; Moise, T ; Kim, D ; Groat, J ; Eliason, J ; Depner, M ; Chu, F</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-7d0da5975756c2a72dd84bdedf978d6e2e2a22a59392268004ced56af30fa8283</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Capacitors</topic><topic>Circuits</topic><topic>Copper</topic><topic>cycling endurance</topic><topic>data retention</topic><topic>embedded memory</topic><topic>Ferroelectric films</topic><topic>Ferroelectric materials</topic><topic>ferroelectric memory reliability</topic><topic>high-temperature operating life</topic><topic>Intelligent sensors</topic><topic>Low voltage</topic><topic>Nonvolatile memory</topic><topic>Polarization</topic><topic>Random access memory</topic><topic>sof-error rate</topic><toplevel>online_resources</toplevel><creatorcontrib>Rodriguez, J</creatorcontrib><creatorcontrib>Remack, K</creatorcontrib><creatorcontrib>Gertas, J</creatorcontrib><creatorcontrib>Wang, L</creatorcontrib><creatorcontrib>Zhou, C</creatorcontrib><creatorcontrib>Boku, K</creatorcontrib><creatorcontrib>Rodriguez-Latorre, J</creatorcontrib><creatorcontrib>Udayakumar, K R</creatorcontrib><creatorcontrib>Summerfelt, S</creatorcontrib><creatorcontrib>Moise, T</creatorcontrib><creatorcontrib>Kim, D</creatorcontrib><creatorcontrib>Groat, J</creatorcontrib><creatorcontrib>Eliason, J</creatorcontrib><creatorcontrib>Depner, M</creatorcontrib><creatorcontrib>Chu, F</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Rodriguez, J</au><au>Remack, K</au><au>Gertas, J</au><au>Wang, L</au><au>Zhou, C</au><au>Boku, K</au><au>Rodriguez-Latorre, J</au><au>Udayakumar, K R</au><au>Summerfelt, S</au><au>Moise, T</au><au>Kim, D</au><au>Groat, J</au><au>Eliason, J</au><au>Depner, M</au><au>Chu, F</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Reliability of Ferroelectric Random Access memory embedded within 130nm CMOS</atitle><btitle>2010 IEEE International Reliability Physics Symposium</btitle><stitle>IRPS</stitle><date>2010-05</date><risdate>2010</risdate><spage>750</spage><epage>758</epage><pages>750-758</pages><issn>1541-7026</issn><eissn>1938-1891</eissn><isbn>1424454301</isbn><isbn>9781424454303</isbn><eisbn>1424454298</eisbn><eisbn>9781424454297</eisbn><eisbn>9781424454310</eisbn><eisbn>142445431X</eisbn><abstract>We present results of a comprehensive reliability evaluation of a 2T-2C, 4Mb, Ferroelectric Random Access Memory embedded within a standard 130nm, 5LM Cu CMOS platform. Wear-out free endurance to 5.4 × 10 13 cycles and data retention equivalent of 10 years at 85°C is demonstrated. The results show that the technology can be used in a wide range of applications including embedded processing.</abstract><pub>IEEE</pub><doi>10.1109/IRPS.2010.5488738</doi><tpages>9</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISSN: 1541-7026
ispartof 2010 IEEE International Reliability Physics Symposium, 2010, p.750-758
issn 1541-7026
1938-1891
language eng
recordid cdi_ieee_primary_5488738
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Capacitors
Circuits
Copper
cycling endurance
data retention
embedded memory
Ferroelectric films
Ferroelectric materials
ferroelectric memory reliability
high-temperature operating life
Intelligent sensors
Low voltage
Nonvolatile memory
Polarization
Random access memory
sof-error rate
title Reliability of Ferroelectric Random Access memory embedded within 130nm CMOS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T20%3A18%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Reliability%20of%20Ferroelectric%20Random%20Access%20memory%20embedded%20within%20130nm%20CMOS&rft.btitle=2010%20IEEE%20International%20Reliability%20Physics%20Symposium&rft.au=Rodriguez,%20J&rft.date=2010-05&rft.spage=750&rft.epage=758&rft.pages=750-758&rft.issn=1541-7026&rft.eissn=1938-1891&rft.isbn=1424454301&rft.isbn_list=9781424454303&rft_id=info:doi/10.1109/IRPS.2010.5488738&rft_dat=%3Cieee_6IE%3E5488738%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1424454298&rft.eisbn_list=9781424454297&rft.eisbn_list=9781424454310&rft.eisbn_list=142445431X&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=5488738&rfr_iscdi=true