Novel 3-D stacked NAND flash string without body cross-talk effect

We have investigated I D -V GS characteristic of proposed 3-D stacked NAND flash string with common gate structure and a shield layer. The body cross-talk problem was eliminated completely. We think proposed structure and its modification will be very promising candidate for future high density NAND...

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Hauptverfasser: Min-Kyu Jeong, Joo-Wan Lee, Ilwhan Cho, Byung-Gook Park, Hyung-Cheol Shin, Jong-Ho Lee
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creator Min-Kyu Jeong
Joo-Wan Lee
Ilwhan Cho
Byung-Gook Park
Hyung-Cheol Shin
Jong-Ho Lee
description We have investigated I D -V GS characteristic of proposed 3-D stacked NAND flash string with common gate structure and a shield layer. The body cross-talk problem was eliminated completely. We think proposed structure and its modification will be very promising candidate for future high density NAND flash memory.
doi_str_mv 10.1109/IMW.2010.5488410
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fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_5488410</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5488410</ieee_id><sourcerecordid>5488410</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-cce1ae2485568a4c0875167facc655c857b108dd46818e159733e6cc7f9a29c03</originalsourceid><addsrcrecordid>eNotkMtOwzAURI0AiVKyR2LjH3Dx29fL0vKoVMKmEuwq17mhoYGg2ID690TQ2YzOLEajIeRS8IkQ3F8vHp8nkg9kNIAW_IicCy21dtaCPCaFd_DH1gkPJ2QkhfFMg3o5I0VKb3yQNtJqGJGbsvvGlio2pymHuMOKltNyTus2pO0Q9c3HK_1p8rb7ynTTVXsa-y4llkO7o1jXGPMFOa1Dm7A4-Jis7m5Xswe2fLpfzKZL1nieWYwoAkoNxlgIOnJwRlhXhxitMRGM2wgOVaUtCMBhsFMKbYyu9kH6yNWYXP3XNoi4_uyb99Dv14cH1C87g0s3</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Novel 3-D stacked NAND flash string without body cross-talk effect</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Min-Kyu Jeong ; Joo-Wan Lee ; Ilwhan Cho ; Byung-Gook Park ; Hyung-Cheol Shin ; Jong-Ho Lee</creator><creatorcontrib>Min-Kyu Jeong ; Joo-Wan Lee ; Ilwhan Cho ; Byung-Gook Park ; Hyung-Cheol Shin ; Jong-Ho Lee</creatorcontrib><description>We have investigated I D -V GS characteristic of proposed 3-D stacked NAND flash string with common gate structure and a shield layer. The body cross-talk problem was eliminated completely. We think proposed structure and its modification will be very promising candidate for future high density NAND flash memory.</description><identifier>ISSN: 2159-483X</identifier><identifier>ISBN: 9781424467198</identifier><identifier>ISBN: 1424467195</identifier><identifier>EISBN: 1424476682</identifier><identifier>EISBN: 1424467217</identifier><identifier>EISBN: 9781424476688</identifier><identifier>EISBN: 9781424467211</identifier><identifier>DOI: 10.1109/IMW.2010.5488410</identifier><language>eng</language><publisher>IEEE</publisher><subject>Character generation ; Doping ; Etching ; Flash memory ; Germanium silicon alloys ; Immune system ; Silicon germanium ; Temperature ; Thermal stresses ; Threshold voltage</subject><ispartof>2010 IEEE International Memory Workshop, 2010, p.1-2</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5488410$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5488410$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Min-Kyu Jeong</creatorcontrib><creatorcontrib>Joo-Wan Lee</creatorcontrib><creatorcontrib>Ilwhan Cho</creatorcontrib><creatorcontrib>Byung-Gook Park</creatorcontrib><creatorcontrib>Hyung-Cheol Shin</creatorcontrib><creatorcontrib>Jong-Ho Lee</creatorcontrib><title>Novel 3-D stacked NAND flash string without body cross-talk effect</title><title>2010 IEEE International Memory Workshop</title><addtitle>IMW</addtitle><description>We have investigated I D -V GS characteristic of proposed 3-D stacked NAND flash string with common gate structure and a shield layer. The body cross-talk problem was eliminated completely. We think proposed structure and its modification will be very promising candidate for future high density NAND flash memory.</description><subject>Character generation</subject><subject>Doping</subject><subject>Etching</subject><subject>Flash memory</subject><subject>Germanium silicon alloys</subject><subject>Immune system</subject><subject>Silicon germanium</subject><subject>Temperature</subject><subject>Thermal stresses</subject><subject>Threshold voltage</subject><issn>2159-483X</issn><isbn>9781424467198</isbn><isbn>1424467195</isbn><isbn>1424476682</isbn><isbn>1424467217</isbn><isbn>9781424476688</isbn><isbn>9781424467211</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2010</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotkMtOwzAURI0AiVKyR2LjH3Dx29fL0vKoVMKmEuwq17mhoYGg2ID690TQ2YzOLEajIeRS8IkQ3F8vHp8nkg9kNIAW_IicCy21dtaCPCaFd_DH1gkPJ2QkhfFMg3o5I0VKb3yQNtJqGJGbsvvGlio2pymHuMOKltNyTus2pO0Q9c3HK_1p8rb7ynTTVXsa-y4llkO7o1jXGPMFOa1Dm7A4-Jis7m5Xswe2fLpfzKZL1nieWYwoAkoNxlgIOnJwRlhXhxitMRGM2wgOVaUtCMBhsFMKbYyu9kH6yNWYXP3XNoi4_uyb99Dv14cH1C87g0s3</recordid><startdate>201005</startdate><enddate>201005</enddate><creator>Min-Kyu Jeong</creator><creator>Joo-Wan Lee</creator><creator>Ilwhan Cho</creator><creator>Byung-Gook Park</creator><creator>Hyung-Cheol Shin</creator><creator>Jong-Ho Lee</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201005</creationdate><title>Novel 3-D stacked NAND flash string without body cross-talk effect</title><author>Min-Kyu Jeong ; Joo-Wan Lee ; Ilwhan Cho ; Byung-Gook Park ; Hyung-Cheol Shin ; Jong-Ho Lee</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-cce1ae2485568a4c0875167facc655c857b108dd46818e159733e6cc7f9a29c03</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Character generation</topic><topic>Doping</topic><topic>Etching</topic><topic>Flash memory</topic><topic>Germanium silicon alloys</topic><topic>Immune system</topic><topic>Silicon germanium</topic><topic>Temperature</topic><topic>Thermal stresses</topic><topic>Threshold voltage</topic><toplevel>online_resources</toplevel><creatorcontrib>Min-Kyu Jeong</creatorcontrib><creatorcontrib>Joo-Wan Lee</creatorcontrib><creatorcontrib>Ilwhan Cho</creatorcontrib><creatorcontrib>Byung-Gook Park</creatorcontrib><creatorcontrib>Hyung-Cheol Shin</creatorcontrib><creatorcontrib>Jong-Ho Lee</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Min-Kyu Jeong</au><au>Joo-Wan Lee</au><au>Ilwhan Cho</au><au>Byung-Gook Park</au><au>Hyung-Cheol Shin</au><au>Jong-Ho Lee</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Novel 3-D stacked NAND flash string without body cross-talk effect</atitle><btitle>2010 IEEE International Memory Workshop</btitle><stitle>IMW</stitle><date>2010-05</date><risdate>2010</risdate><spage>1</spage><epage>2</epage><pages>1-2</pages><issn>2159-483X</issn><isbn>9781424467198</isbn><isbn>1424467195</isbn><eisbn>1424476682</eisbn><eisbn>1424467217</eisbn><eisbn>9781424476688</eisbn><eisbn>9781424467211</eisbn><abstract>We have investigated I D -V GS characteristic of proposed 3-D stacked NAND flash string with common gate structure and a shield layer. The body cross-talk problem was eliminated completely. We think proposed structure and its modification will be very promising candidate for future high density NAND flash memory.</abstract><pub>IEEE</pub><doi>10.1109/IMW.2010.5488410</doi><tpages>2</tpages></addata></record>
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subjects Character generation
Doping
Etching
Flash memory
Germanium silicon alloys
Immune system
Silicon germanium
Temperature
Thermal stresses
Threshold voltage
title Novel 3-D stacked NAND flash string without body cross-talk effect
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T12%3A31%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Novel%203-D%20stacked%20NAND%20flash%20string%20without%20body%20cross-talk%20effect&rft.btitle=2010%20IEEE%20International%20Memory%20Workshop&rft.au=Min-Kyu%20Jeong&rft.date=2010-05&rft.spage=1&rft.epage=2&rft.pages=1-2&rft.issn=2159-483X&rft.isbn=9781424467198&rft.isbn_list=1424467195&rft_id=info:doi/10.1109/IMW.2010.5488410&rft_dat=%3Cieee_6IE%3E5488410%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1424476682&rft.eisbn_list=1424467217&rft.eisbn_list=9781424476688&rft.eisbn_list=9781424467211&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=5488410&rfr_iscdi=true