A 24-channel 300 Gb/s 8.2 pJ/bit full-duplex fiber-coupled optical transceiver module based on a single "holey" CMOS IC

24-channel 850-nm VCSEL and PD arrays are flip-chip soldered to 90-nm CMOS "holey" 48-channel 12.5-Gb/s/channel transceiver chip, featuring through-substrate holes for optical I/O. Aggregate 300-Gb/s bi-drectional data rate is highest reported for single-chip transceiver modules.

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Bibliographische Detailangaben
Hauptverfasser:	Rylyakov, Alexander V, Schow, Clint L, Doany, Fuad E, Lee, Benjamin G, Jahnes, Christopher, Kwark, Young, Baks, Christian, Kuchta, Daniel M, Kash, Jeffrey A
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	CMOS integrated circuits Connectors High speed optical techniques Optical arrays Optical fiber testing Optical fibers Optical receivers Photonic integrated circuits Stimulated emission Transceivers
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Beschreibung
Zusammenfassung:	24-channel 850-nm VCSEL and PD arrays are flip-chip soldered to 90-nm CMOS "holey" 48-channel 12.5-Gb/s/channel transceiver chip, featuring through-substrate holes for optical I/O. Aggregate 300-Gb/s bi-drectional data rate is highest reported for single-chip transceiver modules.
DOI:	10.1364/NFOEC.2010.PDPA8