Creating 3D specific systems: Architecture, design and CAD

Creating 3D specific systems: Architecture, design and CAD

3D stacking and integration can provide system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main application area explored in detail is that of logic on memory. This application is explored in a specific DSP example. Fina...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Franzon, Paul D, Davis, W Rhett, Thorolffson, Thor
Format: Tagungsbericht
Sprache:eng
Schlagworte:
3D IC
3DIC
Application software
Design automation
Dielectric substrates
Digital signal processing
Logic
memory on logic
Silicon
stacked memor
Stacking
Testing
Thermal management
three dimensional IC
Through-silicon vias
TSV
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Beschreibung
Zusammenfassung:3D stacking and integration can provide system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main application area explored in detail is that of logic on memory. This application is explored in a specific DSP example. Finally critical areas that need better solutions are explored. These include design planning, test management, and thermal management.
ISSN:1530-1591
1558-1101
DOI:10.1109/DATE.2010.5457086