A fully packaged piezoelectric switch with lowvoltage actuation and electrostatic hold

This paper reports RF characterization of a fully packaged RF MEMS piezoelectric switch. The switch demonstrates better than 0.8 dB insertion loss at 2 GHz and 30 dB isolation up to 10 GHz. The presented device combines a piezoelectric actuation and a low electrostatic hold voltage to improve contac...

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Bibliographische Detailangaben

Hauptverfasser:	Cueff, Matthieu, Defay, Emmanuel, Rey, Patrice, Le Rhun, Gwenael, Perruchot, Franois, Ferrandon, Christine, Mercier, Denis, Domingue, Frederic, Suhm, Aurelien, Aid, Marc, Lianjiu Liu, Pacheco, Sergio, Miller, Mel
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Contact resistance Electrostatics Insertion loss Low voltage Packaging Radio frequency Radiofrequency microelectromechanical systems Switches Wafer bonding Wafer scale integration
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