A novel vertical solder pump structure for through-wafer interconnects

A novel vertical solder pump structure for through-wafer interconnects

Through wafer interconnection is a critical technology for advanced packaging. Previously, we have proposed a solder pump technology which could complete the via filling through solder reflow. Here, an improved vertical solder-pump structure is presented and successfully demonstrated. This technolog...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Jiebin Gu, Pike, W T, Karl, W J
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Copper
Educational institutions
Feeds
Filling
Gravity
Metallization
Packaging
Potential energy
Surface tension
Vents
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Beschreibung
Zusammenfassung:Through wafer interconnection is a critical technology for advanced packaging. Previously, we have proposed a solder pump technology which could complete the via filling through solder reflow. Here, an improved vertical solder-pump structure is presented and successfully demonstrated. This technology allows producing an arbitrary array of highly conductive vias in seconds.
ISSN:1084-6999
DOI:10.1109/MEMSYS.2010.5442457