A wafer-level heterogeneous technology integration for flexible pseudo-SoC

A wafer-level heterogeneous technology integration for flexible pseudo-SoC

A flexible pseudo-SoC incorporating electrostatic MEMS grating light valves and 40 V high-speed pulse-width modulator (PWM) driver CMOS chip is developed to demonstrate wafer-level heterogeneous technology integration. The pseudo-SoC forms a global layer (line/space = 1 ¿m/1 ¿m) on the MEMS and CMOS...

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Bibliographische Detailangaben
Hauptverfasser: Yamada, H., Onozuka, Y., Iida, A., Itaya, K., Funaki, H.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
CMOS technology
Electrostatics
Epoxy resins
Gratings
Micromechanical devices
Optical modulation
Pulse width modulation
Space technology
Space vector pulse width modulation
Valves
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Beschreibung
Zusammenfassung:A flexible pseudo-SoC incorporating electrostatic MEMS grating light valves and 40 V high-speed pulse-width modulator (PWM) driver CMOS chip is developed to demonstrate wafer-level heterogeneous technology integration. The pseudo-SoC forms a global layer (line/space = 1 ¿m/1 ¿m) on the MEMS and CMOS chips, which are both embedded in epoxy resin, with a total thickness of 100 ¿m.
ISSN:0193-6530
2376-8606
DOI:10.1109/ISSCC.2010.5434011