An estimation method of electroplating current densities in LSI fabrication technology by inverse analysis of electric potentials in cells

In this paper, we have developed a novel technique to estimate electroplating current densities from electric potentials in plating cells for LSI fabrication technology. This technique applies inverse analysis process for the estimation. We have also built a device for measuring electric potentials in the plating cell. Measurement experiments under several electroplating conditions were performed to demonstrate the validity of the proposed technique.