Originality method in selecting high CTE molding underfill for low profile molded FCCSP

In this paper, we propose a originality method in selecting high CTE molding underfill to control the warpage of low profile molded FCCSP with 0.8 mm package height. A test vehicle was designed with package size of 7.5 × 7.5 mm and die size 6.5 × 5.9 mm with 65 nm low K chip, the package height is 0...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HuiMin Huang, ChinNan Lin, HoYi Tsai, YihJenn Jiang, Chiu, S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Electric shock Life estimation Life testing Moisture Packaging Temperature sensors Thermal stresses Vehicles
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