A 3 V MMIC chip set for 1.9 GHz mobile communication systems

A 3 V MMIC chip set for 1.9 GHz mobile communication systems

A MMIC chip-set for 1.9 GHz mobile communication systems consists of a single-pole double-throw (SPDT) switch, a fully-integrated power amplifier, a low-noise amplifier integrated with an auto-gain-control (AGC) amplifier and an up-converter that is integrated on the same chip with a down-converter....

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Hauptverfasser: Tanaka, S., Hase, E., Nakajima, A., Sugano, K., Fujioka, T., Imakado, Y., Fujiwara, K., Okamoto, T., Shigeno, Y., Sato, K., Arai, I., Yamane, M., Kusano, C., Sakamoto, K., Nakagawa, J., Koya, M.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Capacitors
Circuits
Communication switching
FETs
Frequency
Insertion loss
MMICs
Mobile communication
Switches
Voltage
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creator Tanaka, S.
Hase, E.
Nakajima, A.
Sugano, K.
Fujioka, T.
Imakado, Y.
Fujiwara, K.
Okamoto, T.
Shigeno, Y.
Sato, K.
Arai, I.
Yamane, M.
Kusano, C.
Sakamoto, K.
Nakagawa, J.
Koya, M.
description A MMIC chip-set for 1.9 GHz mobile communication systems consists of a single-pole double-throw (SPDT) switch, a fully-integrated power amplifier, a low-noise amplifier integrated with an auto-gain-control (AGC) amplifier and an up-converter that is integrated on the same chip with a down-converter. All four chips operate at a 3/spl plusmn/0.2 V power supply and are fabricated using an ion-implanted GaAs MESFET process. This paper describes characteristics of the chip set and discusses the switch that employs a design technique for improved power performance.
doi_str_mv 10.1109/ISSCC.1995.535467
format Conference Proceeding
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identifier ISSN: 0193-6530
ispartof Proceedings ISSCC '95 - International Solid-State Circuits Conference, 1995, p.144-145
issn 0193-6530
2376-8606
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Capacitors
Circuits
Communication switching
FETs
Frequency
Insertion loss
MMICs
Mobile communication
Switches
Voltage
title A 3 V MMIC chip set for 1.9 GHz mobile communication systems
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