A 3 V MMIC chip set for 1.9 GHz mobile communication systems

A 3 V MMIC chip set for 1.9 GHz mobile communication systems

A MMIC chip-set for 1.9 GHz mobile communication systems consists of a single-pole double-throw (SPDT) switch, a fully-integrated power amplifier, a low-noise amplifier integrated with an auto-gain-control (AGC) amplifier and an up-converter that is integrated on the same chip with a down-converter....

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Hauptverfasser: Tanaka, S., Hase, E., Nakajima, A., Sugano, K., Fujioka, T., Imakado, Y., Fujiwara, K., Okamoto, T., Shigeno, Y., Sato, K., Arai, I., Yamane, M., Kusano, C., Sakamoto, K., Nakagawa, J., Koya, M.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Capacitors
Circuits
Communication switching
FETs
Frequency
Insertion loss
MMICs
Mobile communication
Switches
Voltage
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Beschreibung
Zusammenfassung:A MMIC chip-set for 1.9 GHz mobile communication systems consists of a single-pole double-throw (SPDT) switch, a fully-integrated power amplifier, a low-noise amplifier integrated with an auto-gain-control (AGC) amplifier and an up-converter that is integrated on the same chip with a down-converter. All four chips operate at a 3/spl plusmn/0.2 V power supply and are fabricated using an ion-implanted GaAs MESFET process. This paper describes characteristics of the chip set and discusses the switch that employs a design technique for improved power performance.
ISSN:0193-6530
2376-8606
DOI:10.1109/ISSCC.1995.535467