A new electrothermally-aware methodology for full-chip temperature optimization

Due to the fact that there is electrothermal coupling between power, delay, and temperature, the paper presents a new electrothermally-aware methodology for full-chip temperature optimization. The main idea is that characteristics of temperature distribution can be improved dramatically by a certain...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Gang Dong, Peng Leng, Changchun Chai, Yintang Yang
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	CMOS technology Delay Electrothermal coupling Electrothermal effects Full chip Heat transfer Integrated circuit interconnections Optimization Optimization methods Repeaters Resistance heating Temperature Thermal resistance
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!