Distributed via connectivity in high resolution package power delivery modeling

High resolution electrical models can be generated for chip packaging power delivery networks. The lumped versus distributed stitching of vertical path connections such as micro-via and plated-through-holes can introduce various effects on the model predictions.

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description High resolution electrical models can be generated for chip packaging power delivery networks. The lumped versus distributed stitching of vertical path connections such as micro-via and plated-through-holes can introduce various effects on the model predictions.
doi_str_mv 10.1109/EPEPS.2009.5338433
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identifier ISSN: 2165-4107
ispartof 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, 2009, p.243-246
issn 2165-4107
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Contacts
Distributed Models
Distributed power generation
Engines
Histograms
Packaging
Power Delivery
Power generation
Power supplies
Predictive models
Testing
Via Connectivity
Voltage
title Distributed via connectivity in high resolution package power delivery modeling
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