Distributed via connectivity in high resolution package power delivery modeling
High resolution electrical models can be generated for chip packaging power delivery networks. The lumped versus distributed stitching of vertical path connections such as micro-via and plated-through-holes can introduce various effects on the model predictions.
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creator | Vikinski, O. |
description | High resolution electrical models can be generated for chip packaging power delivery networks. The lumped versus distributed stitching of vertical path connections such as micro-via and plated-through-holes can introduce various effects on the model predictions. |
doi_str_mv | 10.1109/EPEPS.2009.5338433 |
format | Conference Proceeding |
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The lumped versus distributed stitching of vertical path connections such as micro-via and plated-through-holes can introduce various effects on the model predictions.</abstract><pub>IEEE</pub><doi>10.1109/EPEPS.2009.5338433</doi><tpages>4</tpages></addata></record> |
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identifier | ISSN: 2165-4107 |
ispartof | 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, 2009, p.243-246 |
issn | 2165-4107 |
language | eng |
recordid | cdi_ieee_primary_5338433 |
source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Contacts Distributed Models Distributed power generation Engines Histograms Packaging Power Delivery Power generation Power supplies Predictive models Testing Via Connectivity Voltage |
title | Distributed via connectivity in high resolution package power delivery modeling |
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