Distributed via connectivity in high resolution package power delivery modeling

Distributed via connectivity in high resolution package power delivery modeling

High resolution electrical models can be generated for chip packaging power delivery networks. The lumped versus distributed stitching of vertical path connections such as micro-via and plated-through-holes can introduce various effects on the model predictions.

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Vikinski, O.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Contacts
Distributed Models
Distributed power generation
Engines
Histograms
Packaging
Power Delivery
Power generation
Power supplies
Predictive models
Testing
Via Connectivity
Voltage
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:High resolution electrical models can be generated for chip packaging power delivery networks. The lumped versus distributed stitching of vertical path connections such as micro-via and plated-through-holes can introduce various effects on the model predictions.
ISSN:2165-4107
DOI:10.1109/EPEPS.2009.5338433