Investigation of high frequency coupling between probe tips and wafer surface

Investigation of high frequency coupling between probe tips and wafer surface

This paper presents an investigation of the coupling between probe tips and wafer surface through EM-simulation and compares the simulation results to measurements. It is pointed out that the results are very dependent on the adjacent structures lying under the probe tips. Different solutions are an...

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Bibliographische Detailangaben
Hauptverfasser: Bazzi, J., Raya, C., Curutchet, A., Zimmer, T.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
EM simulation
Frequency
HF coupling
Probes
S-parameter measurements
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Beschreibung
Zusammenfassung:This paper presents an investigation of the coupling between probe tips and wafer surface through EM-simulation and compares the simulation results to measurements. It is pointed out that the results are very dependent on the adjacent structures lying under the probe tips. Different solutions are analyzed to master and/or reduce the coupling and ensure reproducibility.
ISSN:1088-9299
2378-590X
DOI:10.1109/BIPOL.2009.5314137