QC-Fill: Quick-and-Cool X-Filling for Multicasting-Based Scan Test

This paper presents an X-fill scheme that properly utilizes the don't-care bits in test patterns to simultaneously reduce the test time as well as the test power (including both capture power and shifting power). This scheme, called Quick-and-Cool X-fill (QC-Fill), built upon the multicasting-b...

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Veröffentlicht in:IEEE transactions on computer-aided design of integrated circuits and systems 2009-11, Vol.28 (11), p.1756-1766
Hauptverfasser: Tzeng, Chao-Wen, Huang, Shi-Yu
Format: Artikel
Sprache:eng
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Zusammenfassung:This paper presents an X-fill scheme that properly utilizes the don't-care bits in test patterns to simultaneously reduce the test time as well as the test power (including both capture power and shifting power). This scheme, called Quick-and-Cool X-fill (QC-Fill), built upon the multicasting-based scan architecture, further leverages on the merits of previous low-capture-power X-fill methods through techniques like multicasting-driven X-fill and clique stripping . QC-Fill is independent of the automatic test pattern generation patterns and does not require any extra area overhead. Experimental results demonstrate that this scheme strikes a good balance between the seemingly conflicting criteria of low power and test compression.
ISSN:0278-0070
1937-4151
DOI:10.1109/TCAD.2009.2030353