CMOS-integrated poly-SiGe cantilevers with read/write system for probe storage device

A poly-SiGe technology enabling a dense array of micro-cantilevers and tips on CMOS is demonstrated. Built from a dual-thickness structural layer, the cantilevers feature a very small initial bending and have a compliant torsional suspension with a stiffness of 3times10 -10 Nm/rad. Sharp tips are fo...

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Hauptverfasser: Severi, S., Heck, J., Chou, T.-K.A., Belov, N., Park, J.-S., Harrar, D., Jain, A., Van Hoof, R., Du Bois, B., De Coster, J., Pedreira, O.V., Willegems, M., Vaes, J., Jamieson, G., Haspeslagh, L., Adams, D., Rao, V., Decoutere, S., Witvrouw, A.
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creator Severi, S.
Heck, J.
Chou, T.-K.A.
Belov, N.
Park, J.-S.
Harrar, D.
Jain, A.
Van Hoof, R.
Du Bois, B.
De Coster, J.
Pedreira, O.V.
Willegems, M.
Vaes, J.
Jamieson, G.
Haspeslagh, L.
Adams, D.
Rao, V.
Decoutere, S.
Witvrouw, A.
description A poly-SiGe technology enabling a dense array of micro-cantilevers and tips on CMOS is demonstrated. Built from a dual-thickness structural layer, the cantilevers feature a very small initial bending and have a compliant torsional suspension with a stiffness of 3times10 -10 Nm/rad. Sharp tips are formed in a low-temperature amorphous silicon layer by isotropic plasma etching. An electrical read/write system is formed by connecting the tip to the CMOS with a suspended platinum trace, running on top of the cantilever.
doi_str_mv 10.1109/SENSOR.2009.5285430
format Conference Proceeding
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Circuits
CMOS technology
CMOS-MEMS integration
Etching
Fabrication
Ferroelectric materials
Germanium silicon alloys
high capacity memory
micro cantilever
poly-SiGe
probe storage
Scanning probe microscopy
Scanning Probe Microscopy (SPM)
sharp tip fabrication
Signal to noise ratio
Silicon germanium
Writing
title CMOS-integrated poly-SiGe cantilevers with read/write system for probe storage device
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