Process integration and manufacturing issues

Ultra-high frequency applications, functional system integration, and regulatory material constraints drive new approaches for integration of heterogeneous technologies and packaging. This session discusses high-speed BiCMOS, lead-free package reliability, and process integration of high-voltage CMO...

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Bibliographische Detailangaben
Hauptverfasser:	Jansen, Philippe, Sunderland, David
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	BiCMOS integrated circuits CMOS process CMOS technology Environmentally friendly manufacturing techniques Frequency Manufacturing processes Packaging
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Beschreibung
Zusammenfassung:	Ultra-high frequency applications, functional system integration, and regulatory material constraints drive new approaches for integration of heterogeneous technologies and packaging. This session discusses high-speed BiCMOS, lead-free package reliability, and process integration of high-voltage CMOS and 3D imagers.
ISSN:	0886-5930 2152-3630
DOI:	10.1109/CICC.2009.5280836