Assessment of LF solder joint reliability by four point cyclic bending

Assessment of LF solder joint reliability by four point cyclic bending

Quick and effective reliability assessment method is one of aspired targets for product development and test. Base on specific design board, this paper study the effect of four-point cyclic bend test parameters, such as deflection and temperature to lead-free solder joint fatigue life and failure mo...

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Bibliographische Detailangaben
Hauptverfasser: Jifan Wang, Yuming Ye, Junying Zhao, Sang Liu, Yunhua Tu, Song Li, Zhiwei Song
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Assembly
Electronics packaging
Environmentally friendly manufacturing techniques
Fatigue
Lead
Life estimation
Life testing
Soldering
Temperature
US Department of Energy
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Beschreibung
Zusammenfassung:Quick and effective reliability assessment method is one of aspired targets for product development and test. Base on specific design board, this paper study the effect of four-point cyclic bend test parameters, such as deflection and temperature to lead-free solder joint fatigue life and failure mode, compare the performance of lead-free joints in four-point cyclic bend and accelerated temperature cycling(ATC), explore the application of four-point cyclic bend test method in lead-free solder joint reliability assessment.
DOI:10.1109/ICEPT.2009.5270686