Development, validation and application of a thermal model of a plastic quad flat pack

A thermal model of a Plastic Quad Flat Pack (PQFP), developed using a computational fluid dynamics (CFD) program is presented. The model predictions are validated with junction-to-ambient thermal resistances measured in still air and infra-red measurements of the package and board surface temperatur...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Rosten, H.I., Parry, J.D., Addison, J.S., Viswanath, R., Davies, M., Fitzgerald, E.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Application software Computational fluid dynamics Computer software Electrical resistance measurement Electronic packaging thermal management Electronics packaging Heat resistance Mathematical models Plastic products Plastics Portable computers Predictive models Temperature Temperature measurement Thermal resistance
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!