Development, validation and application of a thermal model of a plastic quad flat pack

A thermal model of a Plastic Quad Flat Pack (PQFP), developed using a computational fluid dynamics (CFD) program is presented. The model predictions are validated with junction-to-ambient thermal resistances measured in still air and infra-red measurements of the package and board surface temperatur...

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Hauptverfasser: Rosten, H.I., Parry, J.D., Addison, J.S., Viswanath, R., Davies, M., Fitzgerald, E.
Format: Tagungsbericht
Sprache:eng
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Zusammenfassung:A thermal model of a Plastic Quad Flat Pack (PQFP), developed using a computational fluid dynamics (CFD) program is presented. The model predictions are validated with junction-to-ambient thermal resistances measured in still air and infra-red measurements of the package and board surface temperatures. An application of a modified version of the model to a laptop computer is demonstrated. The work forms part of a long term programme to create and validate generic thermal models of a range of electronic parts.
ISSN:0569-5503
DOI:10.1109/ECTC.1995.517835