Qualification issues and pitfalls for advanced semiconductor devices in space

Increasing satellite performance within size, weight and power constraints demands access to advanced semiconductors, yet environmental, reliability and schedule requirements remain. Successful technology insertion requires knowledge of failure mechanisms, design limitations and screening flow. We r...

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Bibliographische Detailangaben
1. Verfasser:	Sunderland, D.A.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	ASICs Electronics packaging Failure analysis Integrated circuit packaging Integrated circuit reliability Integrated circuit technology integrated circuits Power system reliability programmable devices qualification Qualifications radiation effects radiation hardening reliability Satellites Semiconductor devices Space technology spacecraft electronics technology insertion
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Beschreibung
Zusammenfassung:	Increasing satellite performance within size, weight and power constraints demands access to advanced semiconductors, yet environmental, reliability and schedule requirements remain. Successful technology insertion requires knowledge of failure mechanisms, design limitations and screening flow. We review Boeing's approach, critical issues and potential pitfalls, illustrated by experience with IBM ASICs.
ISSN:	1541-7026 1938-1891
DOI:	10.1109/IRPS.2009.5173254