Thermal transient characterization of electronic assemblies by infrared thermography and Delta Vbemeter methods

The severe operating environment of electronic systems, means that the design of electronic boards requires continual investigations, involving not only electronics but also thermal and thermomechanical studies. We present here two complementary experimental methods to characterize the thermal transient behaviour of electronic assemblies and we compare the results obtained. Then, we conclude by presenting the fields of applications for such test equipment.