The integration of SWNTs with CMOS IC after covering Nickel/Gold on the Aluminum electrodes

The integration of SWNTs with CMOS IC after covering Nickel/Gold on the Aluminum electrodes

This paper presents the interconnection of single-walled carbon nanotube (SWNT) between electrodes on a CMOS integrated circuit chip made by TSMC 0.35 mum CMOS process. Alternating current dielectrophoretic force (AC-DEP) method is employed to micro-electrode that makes SWNTs deposited between elect...

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Hauptverfasser: Jung-Tang Huang, Kai-Yuan Jenq, Po-Chin Lin, Hou-Jun Hsu, Ting-Chiang Tsai, Ching-Kong Chen
Format: Tagungsbericht
Sprache:eng
Schlagworte:
AC-DEP
Aluminum
CMOS
CMOS integrated circuits
CMOS process
CMOS technology
Current measurement
Electrodes
Gold
Nickel
Silicon
Surface treatment
SWNTs
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Beschreibung
Zusammenfassung:This paper presents the interconnection of single-walled carbon nanotube (SWNT) between electrodes on a CMOS integrated circuit chip made by TSMC 0.35 mum CMOS process. Alternating current dielectrophoretic force (AC-DEP) method is employed to micro-electrode that makes SWNTs deposited between electrodes. Using electroless nickel and immersion gold to cover the electrodes of Al could really increase the current more than 3 orders when SWNTs are connected between electrodes.
ISSN:2380-632X
2380-6338
DOI:10.1109/IITC.2009.5090378