Embedded micromechanical devices for the monolithic integration of MEMS with CMOS

A flexible, modular manufacturing process for integrating micromechanical and microelectronic devices has been developed. This process embeds the micromechanical devices in an anisotropically etched trench below the surface of the wafer. Prior to microelectronic device fabrication, this trench is re...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Smith, J.H., Montague, S., Sniegowski, J.J., Murray, J.R., McWhorter, P.J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Annealing CMOS process CMOS technology Consumer electronics Etching Laboratories Manufacturing processes Microelectronics Micromechanical devices Monolithic integrated circuits
Online-Zugang:	Volltext bestellen
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