Embedded micromechanical devices for the monolithic integration of MEMS with CMOS

A flexible, modular manufacturing process for integrating micromechanical and microelectronic devices has been developed. This process embeds the micromechanical devices in an anisotropically etched trench below the surface of the wafer. Prior to microelectronic device fabrication, this trench is refilled with oxide, chemical-mechanically polished, and sealed with a nitride cap in order to embed the micromechanical devices below the surface of the planarized wafer. The feasibility of this technique in a manufacturing environment has been demonstrated by combining a variety of embedded micromechanical structures with a 2 /spl mu/m CMOS process on 6 inch wafers. A yield of 78% has been achieved on the first devices manufactured using this technique.