A passive micromachined device for alignment of arrays of single-mode fibers for hermetic photonic packaging-the CLASP concept

A micro-machined fiber alignment device, called the capture and locking alignment spring positioner (CLASP) has been fabricated. It uses a nickel leaf spring to passively capture vertical arrays of single-mode fibers with /spl sim/2 /spl mu/m accuracy.

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging packaging, and manufacturing technology. Part B, Advanced packaging, 1996-02, Vol.19 (1), p.83-89
Hauptverfasser:	Kravitz, S.H., Word, J.C., Bauer, T.M., Seigal, P.K., Armendariz, M.G.
Format:	Artikel
Sprache:	eng
Schlagworte:	Alignment Applied sciences Arrayed waveguide gratings Arrays Circuit properties Elastic moduli Electric, optical and optoelectronic circuits Electronics Electronics packaging Electroplating Exact sciences and technology Fabrication Friction Integrated optics. Optical fibers and wave guides Micromachining Nickel Optical and optoelectronic circuits Optical arrays Optical devices Optical fiber devices Optical fibers Optical surface waves Optical waveguides Packaging Polyimides Springs Springs (components) Substrates
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A micro-machined fiber alignment device, called the capture and locking alignment spring positioner (CLASP) has been fabricated. It uses a nickel leaf spring to passively capture vertical arrays of single-mode fibers with /spl sim/2 /spl mu/m accuracy.
ISSN:	1070-9894 1558-3686
DOI:	10.1109/96.486489